LOW TEMPERATURE SILICONE

Product Details

We have developed a phenyl base compound to be used in products that will operate at temperatures below -55ºC. The compound can be used for molding and extrusion, offering very good resistance to temperatures as low as -100º.

They can be used for molding, extrusion, wire & cable and calendering applications.

Compound Specifications:
Hardness (Shore A): 30 – 70
Specific Gravity (gms/cm³): 1.20 – 1.30
Tensile strength (psi) D412: 800 – 1400
Elongation (%) D412: 400 – 650
Min Temperature: -100ºC
Color: Will match your requirement